The gold-tin solder paste is a reliable substance used in the field of microelectronics and semiconductors, widely applied in military, aerospace, and medical equipment due to its dependable packaging. Additionally, it is suitable for SiP and high thermal conductivity packaging of high-power devices. Its metallic properties ensure outstanding performance and dependability throughout the soldering process.
The eutectic gold-tin solder paste FH-280 series alloy is composed of 80wt% gold and 20wt% tin (Au80Sn20).
Leveraging the exceptional characteristics of the FH-280 product and Fitech’s advanced powder manufacturing technology, FH-280 offers numerous advantages including high tensile strength, outstanding corrosion resistance, excellent thermal creep performance, and extraordinary compatibility with other precious metals.
Moreover, it exhibits excellent electrical conductivity and thermal conductivity.
The melting point of the FH280 series solder paste is 280℃ with particle sizes ranging from T3 to T6, making it suitable for both printing and dispensing processes.
China First One-stop Gold factory.
We will contact you within 1 working day, please pay attention to the email with “zhongyong8149@163.com”.