Silver bonding wires have been developed as a perfect combination of significant cost reduction compared to gold and required bonding features for sensitive devices. They achieve good reliability and excellent bondability. With a diameter up to a size of 0.6 mils / 15 microns they are suitable for fine structures with a ultra-fine pitch.
The electronic market is under continuous cost pressure. In order to reduce costs, there is a trend towards bonding wires made from materials other than gold. However, not every material is appropriate for every application. For example, whenever dies have sensitive or thin bond pads, copper could damage the chip in the bonding process. Being soft enough for sensitive materials, silver as a cost effective material is a good alternative to gold in such a case.
Heraeus offers a big portfolio of silver based bonding wires exactly fitting to your different applications and requirements. They contain silver as the main component (~89-99%) and further alloy elements and dopants in order to work out exactly the required configuration. Extensive test techniques qualify our bonding wires for your application: Extended reliability test intervals in temperate cycling as well as high temperature conditions and HAST (Highly Accelerated Stress Test).
For the selection or the ideal solution, our specialists with years of experience support you with their technical expertise and application know-how. On-site, they help you on the evaluation and qualification, especially on complex issues and configurations. Tests in our application and technology center enable us to test your adaptations directly in the application. Save time and money with Heraeus as a qualified partner and accelerate your developing process.
China First One-stop Gold factory.
We will contact you within 1 working day, please pay attention to the email with “zhongyong8149@163.com”.